High resolution display device

ABSTRACT

A display device according to an exemplary embodiment includes: a substrate including a display region configured to display an image, and a pad region positioned around the display region; and a first pad unit positioned on the pad region, wherein the first pad unit includes a first terminal region including a plurality of first pad terminals arranged in a first pattern, and a second terminal region including a plurality of second pad terminals arranged in a second pattern different from the first pattern.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. patentapplication Ser. No. 15/648,122 filed on Jul. 12, 2017, which claimspriority under 35 USC § 119 to Korean Patent Application No.10-2016-0088890 filed in the Korean Intellectual Property Office on Jul.13, 2016, the entire contents of which are incorporated herein byreference.

BACKGROUND (a) Technical Field

The present disclosure relates generally to display devices. Morespecifically, the present disclosure relates to high resolution displaydevices.

(b) Description of the Related Art

Display devices which are currently known include a liquid crystaldisplay (LCD), a plasma display panel (PDP), an organic light emittingdiode display (OLED display), a field effect display (FED), anelectrophoretic display device, and the like.

Particularly, the organic light emitting diode display includes twoelectrodes and an organic emission layer positioned therebetween,wherein an electron injected from one electrode and a hole injected fromthe other electrode are coupled with each other in the organic emissionlayer to generate an exciton, and the exciton emits energy to emitlight.

Since the organic light emitting diode display has a self-luminancecharacteristic and does not require a separate light source, unlike theLCD, a thickness and a weight thereof may be reduced. Further, since theorganic light emitting diode display has desirable characteristics suchas low power consumption, high luminance, and a high response speed, theOLED display receives attention as a next-generation display device.

To drive the organic light emitting element of the organic lightemitting diode display, a printed circuit board (PCB) is bonded to aperipheral area of the substrate and driving signals are transmittedthrough the printed circuit board (PCB).

However, as display resolution increases, the number of pad terminalsbonded with the printed circuit board (PCB) also increases. Accordingly,a size of the peripheral area in which the pad terminal is disposed isincreased such that the display region shrinks, and if resistance ofwiring connected to some pad terminals increases, luminance of thedisplay device is reduced.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the invention andtherefore it may contain information that does not form the prior artthat is already known in this country to a person of ordinary skill inthe art.

SUMMARY

Embodiments of the present invention provide a display device capable ofdisposing many pad terminals in the peripheral area.

Also, embodiments of the present invention provide a display devicepreventing luminance reduction due to resistance increase in the wiringpositioned near the pad terminal.

A display device according to an exemplary embodiment includes: asubstrate including a display region configured to display an image anda pad region positioned around the display region; and a first pad unitpositioned on the pad region. The first pad unit includes a firstterminal region including a plurality of first pad terminals arranged ina first pattern, and a second terminal region including a plurality ofsecond pad terminals arranged in a second pattern different from thefirst pattern.

The first terminal region and the second terminal region may be arrangedalong a first direction.

The plurality of first pad terminals may include: a plurality of firstcolumn sub-pad terminals arranged substantially along a first lineforming a first inclination angle with the first direction; a pluralityof second column sub-pad terminals arranged substantially along a secondline, separated from the plurality of first column sub-pad terminals,the second line forming a second inclination angle with the first line;and a plurality of first terminal connection lines each connecting oneamong the plurality of first column sub-pad terminals and one among theplurality of second column sub-pad terminals, each first terminalconnection line having a shape with at least one bend.

The first inclination angle and the second inclination angle may besubstantially equal.

The first inclination angle and the second inclination angle may each bebetween 0 degrees and 90 degrees.

A plurality of first column sub-pad terminals and a plurality of secondcolumn sub-pad terminals may each have a quadrangular shape.

The quadrangular shape may include a first side parallel to the firstdirection and a second side adjacent to the first side and parallel tothe second direction, and the second side may be longer than the firstside.

At least one first dummy pad terminal may be disposed between a pair ofadjacent first column sub-pad terminals.

The first column sub-pad terminals and at least one first dummy padterminal may be arranged along a same line.

At least one second dummy pad terminal may be disposed between a pair ofadjacent second column sub-pad terminals.

The second column sub-pad terminals and at least one second dummy padterminal may be arranged along a same line.

The second terminal region may include two regions disposed at two sidesof the first terminal region.

The first terminal region may include two regions disposed at two sidesof the second terminal region.

The plurality of second pad terminals may respectively include a pair ofsecond sub-pad terminals separated from each other, and a substantiallystraight second terminal connection line connecting the pair of secondsub-pad terminals to each other.

The pair of second sub-pad terminals may be arranged along one line.

The pair of second sub-pad terminals may be arranged along a seconddirection perpendicular to the first direction.

The pair of second sub-pad terminals may be arranged along a lineoriented at a third inclination angle with respect to the firstdirection.

The third inclination angle may be between 0 degrees and 90 degrees.

A base film, and a printed circuit board (PCB) positioned at one side ofthe base film and including a second pad unit with a shape correspondingto the first pad unit and bonded to the first pad unit, may be furtherincluded.

The second pad unit may include a third terminal region including aplurality of third pad terminals arranged in a third patterncorresponding to the first pattern, and a fourth terminal regionincluding a plurality of fourth pad terminals arranged in a fourthpattern corresponding to the second pattern.

The plurality of third pad terminals may respectively include aplurality of third column sub-pad terminals arranged substantially alonga third line forming the first inclination angle with the firstdirection, and a plurality of fourth column sub-pad terminals separatedfrom the plurality of third column sub-pad terminals, and arrangedsubstantially along a fourth line forming the second inclination anglewith the first direction.

The fourth terminal region may be positioned at both sides of the thirdterminal region.

The fourth terminal region may be positioned between a pair of the thirdterminal regions.

The plurality of fourth pad terminals may respectively include a pair offourth sub-pad terminals separated from each other.

The pair of fourth sub-pad terminals may be arranged along one line.

The one line may form the third inclination angle with the firstdirection, and the another side of the base film being different fromthe one side of the base film.

The printed circuit board (PCB) may further include a driving chippositioned at another side of the base film.

The base film may be flexible.

The first pad terminals may be connected to respective ones of the datalines disposed in the display region.

The second pad terminals may be respectively connected to power linesdisposed in the display region.

The power lines may include at least one among a driving voltage line, acommon power line, an initialization power line, and a gate line.

According to the above-described display device, a large number of thepad terminals may be disposed in the peripheral area.

Also, a reduction in luminance due to a resistance increase of thewiring around the pad terminal may be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic top plan view of a display device according to anexemplary embodiment.

FIG. 2 is a cross-sectional view taken along a line II-II′ of FIG. 1.

FIG. 3 is a schematic view showing a display region of FIG. 1.

FIG. 4 is a cross-sectional view taken along a line IV-IV′ of FIG. 3.

FIG. 5 is an enlarged view of a first terminal region of FIG. 1.

FIG. 6 is an enlarged view of a second terminal region of FIG. 1.

FIG. 7 is a view of an exemplary variation of a second terminal regionof FIG. 6.

FIG. 8 is a view of an exemplary variation of a first terminal region ofFIG. 1.

FIG. 9 is a schematic top plan view of a printed circuit board (PCB)bonded to a display device of FIG. 1.

FIG. 10 is an enlarged view of a third terminal region of FIG. 9.

FIG. 11 is a cross-sectional view taken along a line XI-XI′ of FIG. 10.

FIG. 12 is an enlarged view of a fourth terminal region of FIG. 9.

FIG. 13 is a cross-sectional view taken along a line XIII-XIII′ of FIG.12.

FIG. 14 is a view of an exemplary variation of a fourth terminal regionof FIG. 12.

FIG. 15 is a view of a first exemplary variation of a printed circuitboard (PCB) of FIG. 9.

FIG. 16 is a view of a second exemplary variation of a printed circuitboard (PCB) of FIG. 9.

FIG. 17 is a view schematically showing a state in which a secondterminal region formed in a substrate and a fourth terminal regionformed in a printed circuit board (PCB) are bonded.

FIG. 18 is a cross-sectional view taken along a line XVIII-XVIII′ ofFIG. 17.

FIG. 19 is a view schematically showing a state in which a secondterminal region formed in a substrate and a third terminal region formedin a printed circuit board (PCB) are bonded.

FIG. 20 is a cross-sectional view taken along a line XX-XX′ of FIG. 19.

FIG. 21 is a view of an exemplary variation of the display device ofFIG. 1.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, exemplary embodiments will be described in detail so as tobe easily practiced by a person skilled in the art to which the presentinvention pertains, with reference to the accompanying drawings. Asthose skilled in the art would realize, the described embodiments may bemodified in various different ways, all without departing from thespirit or scope. The drawings and description are to be regarded asillustrative in nature and not restrictive. Like reference numeralsdesignate like elements throughout the specification.

In addition, the size and thickness of each component shown in thedrawings are arbitrarily shown for better understanding and ease ofdescription, but the present invention is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc.,are exaggerated for clarity. In the drawings, for better understandingand ease of description, the thickness of some layers and areas isexaggerated. The drawings are thus not to scale. It will be understoodthat when an element such as a layer, film, region, or substrate isreferred to as being “on” another element, it can be directly on theother element or intervening elements may also be present.

In addition, unless explicitly described to the contrary, the word“comprise” and variations such as “comprises” or “comprising” will beunderstood to imply the inclusion of stated elements but not theexclusion of any other elements. Furthermore, when the first part isdescribed as being arranged “on” the second part, this indicates thatthe first part is arranged at an upper side or a lower side of thesecond part without the limitation to the upper side thereof on thebasis of the gravity direction.

All numerical values are approximate, and may vary. All examples ofspecific materials and compositions are to be taken as non-limiting andexemplary only. Other suitable materials and compositions may be usedinstead.

Now, a display device according to an exemplary embodiment will bedescribed with reference to FIG. 1 and FIG. 2.

FIG. 1 is a schematic top plan view of a display device according to anexemplary embodiment, and FIG. 2 is a cross-sectional view taken along aline II-II′ of FIG. 1.

Referring to FIG. 1 and FIG. 2, the display device according to thepresent exemplary embodiment may include a substrate SUB, a first padunit PAD_1, and a printed circuit board (PCB) 300. In the presentexemplary embodiment, a first terminal region TL_1 and a second terminalregion TL_2 are formed at a first pad unit PAD_1 of the printed circuitboard (PCB) 300, and a plurality of first pad terminals PAD_TL_A(referring to FIG. 5) disposed at the first terminal region TL_1 and aplurality of second pad terminals PAD_TL_B (referring to FIG. 5)disposed at the second terminal region TL_2 may be formed with differentpatterns.

Referring to FIG. 1 and FIG. 2, the display device according to thepresent exemplary embodiment may include a display region DA and a padregion PNL_PAD. The display region DA and the pad region PNL_PADrepresent a region positioned on the substrate SUB.

The display region DA is a region displaying an image, and a displaypanel 100 (referring to FIG. 3) emitting light may be disposed in thedisplay region DA. The display panel 100 will be described furtherbelow.

The pad region PNL_PAD is a region positioned around the display regionDA, and the pad region PNL_PAD may be bonded with the printed circuitboard (PCB) 300 so as to transmit signals from an external source. Thefirst pad unit PAD_1 is disposed in the pad region PNL_PAD, thereby thefirst pad unit PAD_1 and the printed circuit board (PCB) 300 may beelectrically coupled.

In this case, the first pad unit PAD_1 may include a first terminalregion TL_1 and a second terminal region TL_2. The first terminal regionTL_1 and the second terminal region TL_2 represent a region positionedon the substrate SUB.

A plurality of first pad terminals PAD_TL_A (referring to FIG. 5) may bedisposed in the first terminal region TL_1, and a plurality of secondpad terminals PAD_TL_B (referring to FIG. 6) may be disposed in thesecond terminal region TL_2. The plurality of first pad terminalsPAD_TL_A may be disposed with a first pattern in the first terminalregion TL_1. Also, the plurality of second pad terminals PAD_TL_B may bedisposed in the second terminal region TL_2 with the second pattern thatis different from the first pattern. Here, the pattern represents ashape in which the pad terminals in the first terminal region TL_1 andthe second terminal region TL_2 are disposed.

That is, according to the present exemplary embodiment, the plurality offirst pad terminals PAD_TL_A and the plurality of second pad terminalsPAD_TL_B may be disposed with different shapes in the first terminalregion TL_1 and the second terminal region TL_2. The structure of thefirst terminal region TL_1 and the second terminal region TL_2 isdescribed in further detail below.

The first terminal region TL_1 and the second terminal region TL_2 ofthe pad region PNL_PAD may be disposed in parallel in the firstdirection. In this case, the pad region PNL_PAD may be disposed to beseparated from the display region DA in the second direction. Hereafter,an X-axis and a Y-axis representing coordinates in the drawing representthe first direction and the second direction, respectively.

In the present exemplary embodiment, as shown in FIG. 1, the secondterminal region TL_2 may be positioned at both sides of the firstterminal region TL_1. However, the arrangement structure of the firstterminal region TL_1 and the second terminal region TL_2 is not limitedthereto, and like an exemplary variation shown in FIG. 21, the secondterminal region TL_2 may be disposed between a pair of first terminalregions TL_1.

Connection wiring CL is positioned between the display region DA and thepad region PNL_PAD, and the display region DA and the pad region PNL_PADmay be connected by the connection wiring CL. The connection wiring CLmay be connected to a plurality of signal lines disposed in the displayregion DA. Also, the connection wiring CL may be connected with thefirst pad terminals PAD_TL_A of the pad region PNL_PAD and the pluralityof second pad terminals PAD_TL_B.

In this case, the connection wiring CL may include first connectionwiring CL_A and second connection wiring CL_B. The first connectionwiring CL_A may connect the display region DA and the first terminalregion TL_1 to each other, and the second connection wiring CL_B mayconnect the display region DA and the second terminal region TL_2 toeach other.

The printed circuit board (PCB) 300 is bonded to the first pad unitPAD_1 of the pad region PNL_PAD of the substrate SUB, therebytransmitting the signal required for driving the display panel 100. Adriving chip 350 may be mounted on a base film 310 of the printedcircuit board (PCB) 300, and the driving chip 350 may be used fordriving the display panel 100.

In this case, in the printed circuit board (PCB) 300, a second pad unitPAD_2 is formed at one end of the base film 310, and the second pad unitPAD_2 may be bonded to the first pad unit PAD_1 of the substrate SUB.The second pad unit PAD_2 may be disposed to face the first pad unitPAD_1.

The second pad unit PAD_2 may include a third terminal region TL_3 and afourth terminal region TL_4. The third terminal region TL_3 and thefourth terminal region TL_4 represent a region positioned on the basefilm 310.

In the third terminal region TL_3, a plurality of third pad terminalsPAD_TL_C (referring to FIG. 10) may be disposed, and a plurality offourth pad terminals PDA_TL_D (referring to FIG. 12) may be disposed inthe fourth terminal region TL_4.

The plurality of third pad terminals PAD_TL_C may be formed of a thirdpattern corresponding to the above-described first pattern, in the thirdterminal region TL_3. In this case, the third pattern may have a shapethat is the same as or similar to the first pattern. Also, the pluralityof fourth pad terminals PAD_TL_D may be formed of a fourth patterncorresponding to the above-described second pattern, in the fourthterminal region TL_4. In this case, the fourth pattern may have a shapethat is the same as or similar to the second pattern.

That is, according to the present exemplary embodiment, the second padunit PAD_2 of the printed circuit board (PCB) 300 may be formed in ashape corresponding to the first pad unit PAD_1 of the substrate SUB.That is, the plurality of pad terminals disposed in the second pad unitPAD_2 may be disposed in a pattern that is the same as or similar tothat of the first pad unit PAD_1. The structure of the third terminalregion TL_3 and the fourth terminal region TL_4 will be described infurther detail below.

Next, the display panel 100 formed in the display region DA will bedescribed with reference to FIG. 3 and FIG. 4.

FIG. 3 is a schematic view showing a display region of FIG. 1, and FIG.4 is a cross-sectional view taken along a line IV-IV′ of FIG. 3.

According to the present exemplary embodiment, the display panel 100includes first gate wires GW1, second gate wires GW2, data wires DW, adisplay unit 140, and a pixel 150.

A gate driver 210 sequentially supplies a scan signal to a first scanlines SC2-SC2 n or second scan lines SC1-SC2 n-1 included in the firstgate wires GW1 and the second gate wires GW2, in response to a controlsignal supplied from an external control circuit (not shown), forexample, a timing controller. Here, n is an integer of 1 or more.

Thus, the pixels 150 are selected by a scan signal, thereby sequentiallyreceiving a data signal. In this case, the gate driver 210 shown in FIG.3 may be formed in the driving chip 350 on the printed circuit board(PCB) 300, but for convenience of description, just the gate driver 210is shown in FIG. 3.

The first gate wires GW1 are positioned on the substrate SUB with afirst insulating layer GI1 interposed thereunder, and extend in thefirst direction. The first gate wires GW1 include a second scan line SC2n-1 and a light emission control line En.

The second scan line SC2 n-1 is connected to the gate driver 210 and issupplied with the scan signal from the gate driver 210. The lightemission control line En is connected to a light emission control driver220, and is supplied with the light emission control signal from thelight emission control driver 220. In this case, the light emissioncontrol driver 220 shown in FIG. 3 may be formed within the driving chip350 on the printed circuit board (PCB) 300 like the gate driver 210, butfor convenience of description, just the light emission control driver220 is shown in FIG. 3.

The second gate wires GW2 are positioned on the first gate wires GW1 viaa second insulating layer G12 interposed therebetween, and extend in thefirst direction. The second gate wires GW2 include a first scan line SC2n and an initialization power line Vinit.

The first gate wires GW1 and the second gate wires GW2 do not overlapeach other, but are instead placed in alternating order.

The first scan line SC2 n is connected to the gate driver 210 and issupplied with the scan signal from the gate driver 210. Theinitialization power line Vinit is connected to the gate driver 210 andreceives initialization power from the gate driver 210.

In an exemplary embodiment, the initialization power line Vinit receivesinitialization power from the gate driver 210, however theinitialization power line Vinit may be connected to an additionalconfiguration to receive initialization power from the additionalconfiguration.

The light emission control driver 220 sequentially supplies the lightemission control signal to the light emission control line En inresponse to a control signal supplied from an external component such asa timing controller. Thus, the emission of the pixel 150 is controlledby the light emission control signal.

That is, the light emission control signal controls an emission time ofthe pixel 150. However, the light emission control driver 220 may beomitted depending on the configuration of the pixel 150.

A data driver 230 supplies the data signal to the data line DAm amongthe data wires DW, in response to a control signal supplied from anexternal component such as a timing controller. The data signal suppliedto the data line DAm is supplied to the pixel 150 selected by the scansignal whenever the scan signal is supplied to a particular scan lineSC. Thus, the pixel 150 charges the voltage corresponding to the datasignal and emits a luminance corresponding thereto. Here, the datadriver 230 shown in FIG. 3 may be formed in the driving chip 350 on theprinted circuit board (PCB) 300, but for convenience of explanation,only the data driver 230 is shown in FIG. 3.

The data wires DW are positioned on the second gate wires GW2 via thethird insulating layer ILD interposed therebetween, and extend in thesecond direction crossing the first direction. The data wires DW includedata lines DA1-DAm and a driving power line ELVDDL. Each data line DAmis connected to the data driver 230 and receives data signals from thedata driver 230. The driving power line ELVDDL is connected to anexternal first power source ELVDD that will be described later, andreceives driving power from the first power source ELVDD.

In this case, the driving power line ELVDDL and the data line DAm may beformed from, or on, the same layer on the third insulating layer ILD.However, the present invention is not limited thereto, and the drivingpower line ELVDDL and the data line DAm may be formed from, or on,different layers.

For example, the driving power line ELVDDL may be formed from the samelayer as the first gate wire GW1, and the data line DAm may be formedfrom the same layer as the second gate wire GW2. In contrast, thedriving power line ELVDDL may be formed from the same layer as thesecond gate wire GW2, and the data line DAm may be formed from the samelayer as the first gate wire GW1.

The display unit 140 includes a plurality of pixels 150 positionedcrossings of the first gate wires GW1, the second gate wires GW2, andthe data wires DW. Here, each pixel 150 includes an organic lightemitting element that emits light of a luminance corresponding to adriving current corresponding to the data signal, and a pixel circuit tocontrol the driving current flowing to the organic light emittingelement.

The pixel circuit is respectively connected to the first gate wires GW1,the second gate wires GW2, and the data wires DW, and the organic lightemitting element is connected to the pixel circuit. The pixel 150 isdescribed as an organic light emitting element, however the pixel 150applied to the display device of the present exemplary embodiment is notlimited thereto, and it may be for example a liquid crystal displayelement or an electrophoretic display element.

The organic light emitting element of the display unit 140 is connectedto the external first power source ELVDD via the pixel circuitinterposed therebetween, and is also connected to a second power sourceELVSS. The first power source ELVDD and the second power source ELVSSrespectively supply driving power and common power to the pixel 150 ofthe display unit 140, and the pixel 150 emits light with a luminancecorresponding to the driving current from the first power source ELVDDand the common power source.

As described above, in the display device according to an exemplaryembodiment, the first gate wires GW1 and the second gate wires GW2transverse the pixel 150 in the first direction and do not overlap eachother. They are not positioned at the same layer either, but instead thefirst gate wires GW1 and the second gate wires GW2 are respectivelypositioned at different layers from each other via the second insulatinglayer G12, and accordingly a distance W between adjacent gate wires maybe decreased, thereby forming more pixels 150 in the same area. That is,a high resolution display device may be formed.

Next, the structure of the first pad terminals PAD_TL_A disposed in thefirst terminal region TL_1 will be described with reference to FIG. 5.

FIG. 5 is an enlarged view of a first terminal region of FIG. 1.

Referring to FIG. 5, a plurality of first pad terminals PAD_TL_A may bedisposed in the first terminal region TL_1. In this case, the firstterminal region TL_1 may be connected to the data wires DW of thedisplay region DA through the first connection wiring CL_A. Theplurality of first pad terminals PAD_TL_A may be disposed to beseparated by a predetermined interval in the first direction within thefirst terminal region TL_1.

The plurality of first pad terminals PAD_TL_A may respectively includefirst column sub-pad terminals ROW_PAD_A, second column sub-padterminals ROW_PAD_B, and first terminal connection lines TL_CN_A.

In the present exemplary embodiment, the first column sub-pad terminalsROW_PAD_A may be disposed to be separated from each other in onedirection. In this case, first column sub-pad terminals ROW_PAD_A mayform a first inclination angle θ1 with the first direction. That is, thefirst column sub-pad terminals ROW_PAD_A may be arranged along a linethat is inclined at the first inclination angle θ1 with respect to thefirst direction. The first inclination angle θ1 may be in a range of 0degrees-90 degrees (excluding 0 degrees and 90 degrees).

Meanwhile, the first column sub-pad terminals ROW_PAD_A disposed in thefirst terminal region TL_1 may be disposed to be inclined in the samedirection. That is, the first column sub-pad terminals ROW_PAD_A may beinclined at the same angle with respect to the X-axis, in the firstterminal region TL_1. For example, as shown in FIG. 1, the first columnsub-pad terminals ROW_PAD_A may be inclined at an approximate 1 o'clockdirection.

However, embodiments are not limited thereto, and as shown in FIG. 8, apart of the first column sub-pad terminals ROW_PAD_A disposed in thefirst terminal region TL_1 may be disposed to be inclined in anapproximate 11 o'clock direction. In this case, the rest of the firstcolumn sub-pad terminals ROW_PAD_A may be disposed to be inclined in theapproximate 1 o'clock direction.

Meanwhile, the interval between adjacent first column sub-pad terminalsROW_PAD_A may be constant. For example, the interval between the firstcolumn sub-pad terminal ROW_PAD_A_1 and the first column sub-padterminal ROW_PAD_A_2, the interval between the first column sub-padterminal ROW_PAD_A_2 and the first column sub-pad terminal ROW_PAD_A_3,and the interval between the first column sub-pad terminal ROW_PAD_A_3and the first column sub-pad terminal ROW_PAD_A_4 may be the same. Thefirst column sub-pad terminals ROW_PAD_A may be formed with anapproximate quadrangular shape.

The second column sub-pad terminals ROW_PAD_B may be disposed to beseparated from the first column sub-pad terminals ROW_PAD_A in thesecond direction. Like the first column sub-pad terminals ROW_PAD_A, thesecond column sub-pad terminals ROW_PAD_B may be disposed to beseparated from each other in one direction.

In this case, the second column sub-pad terminals ROW_PAD_B may form asecond inclination angle θ2 with the first direction. That is, thesecond column sub-pad terminals ROW_PAD_B may be arranged along a linethat is inclined at the second inclination angle θ2 with respect to thefirst direction. The second inclination angle θ2 may be in the range of0 degrees-90 degrees (excluding 0 degrees and 90 degrees). Meanwhile,the second column sub-pad terminals ROW_PAD_B disposed in the firstterminal region TL_1 may be disposed to be inclined in the samedirection, like the first column sub-pad terminals ROW_PAD_A. That is,the second column sub-pad terminals ROW_PAD_B may be disposed to beinclined at the same angle with respect to the X-axis within the firstterminal region TL_1. For example, as shown in FIG. 1, the second columnsub-pad terminals ROW_PAD_B may be disposed to be inclined at anapproximate 1 o'clock direction.

However, embodiments are not limited thereto, and as shown in FIG. 8,part of the second column sub-pad terminals ROW_PAD_B disposed in thefirst terminal region TL_1 may be disposed to be inclined at anapproximate 11 o'clock direction. In this case, the rest of the secondcolumn sub-pad terminals ROW_PAD_B may be disposed in the approximate 1o'clock direction.

In the present exemplary embodiment, the first inclination angle θ1 andthe second inclination angle θ2 may be equal. Accordingly, the firstcolumn sub-pad terminals ROW_PAD_A and the second column sub-padterminals ROW_PAD_B may be disposed to be inclined at the same anglewith respect to the first direction. However, the present invention isnot limited thereto, and the first inclination angle θ1 and the secondinclination angle θ2 may be different from each other. Accordingly, thefirst column sub-pad terminals ROW_PAD_A and the second column sub-padterminals ROW_PAD_B may be arranged to be inclined at different anglesfrom each other with respect to the first direction.

Meanwhile, referring to FIG. 1 and FIG. 5, the plurality of first padterminals PAD_TL_A disposed in the first terminal region TL_1 may bedisposed to be inclined in the same direction. That is, the first columnsub-pad terminals ROW_PAD_A and the second column sub-pad terminalsROW_PAD_B, making up the plurality of first pad terminals PAD_TL_A, mayall be disposed to be inclined at the same angle with respect to theX-axis.

However, embodiments are not limited thereto, and as shown in FIG. 8, aplurality of first pad terminals PAD_TL_A disposed in the first terminalregion TL_1 may be disposed to be symmetric to each other with respectto a center region of the first terminal region TL_1. For example, theplurality of first pad terminals PAD_TL_A to the left of the centerregion of the first terminal region TL_1 may be inclined at anapproximate 1 o'clock direction, and the plurality of first padterminals PAD_TL_A to the right of the center region of the firstterminal region TL_1 may be inclined at an approximate 11 o'clockdirection.

Meanwhile, the interval between the adjacent second column sub-padterminals ROW_PAD_B may be constant. For example, the interval betweenthe second column sub-pad terminal ROW_PAD_B_1 and the second columnsub-pad terminal ROW_PAD_B_2, the interval between the second columnsub-pad terminal ROW_PAD_B_2 and the second column sub-pad terminalROW_PAD_B_3, and the interval between the second column sub-pad terminalROW_PAD_B_3 and the second column sub-pad terminal ROW_PAD_B_4 may beequal.

The second column sub-pad terminals ROW_PAD_B may have a substantiallyquadrangular shape.

In the present exemplary embodiment, the quadrangle forming each shapeof the first column sub-pad terminals ROW_PAD_A and the second columnsub-pad terminals ROW_PAD_B may include a first side L1 parallel to thefirst direction (the X-axis) and a second side L2 parallel to the seconddirection (the Y-axis). Here, the first side L1 and the second side L2may be adjacent to each other.

In this case, the second side L2 may be longer than the first side L1(L1<L2). That is, the quadrangle may have a rectangular shape that iselongated in the second direction (the Y-axis).

According to the present exemplary embodiment, if the first columnsub-pad terminals ROW_PAD_A and the second column sub-pad terminalsROW_PAD_B are formed as rectangles that are elongated in the seconddirection, the interval between the first column sub-pad terminalsROW_PAD_A or the second column sub-pad terminals ROW_PAD_B in the firstdirection (the X-axis) may be reduced.

Accordingly, a number of first column sub-pad terminals ROW_PAD_A andsecond column sub-pad terminals ROW_PAD_B disposed in the first terminalregion TL_1 may be increased.

The plurality of first column sub-pad terminals ROW_PAD_A and theplurality of second column sub-pad terminals ROW_PAD_B may be connectedby a plurality of first terminal connection lines TL_CN_A. In detail,each of the first terminal connection lines TL_CN_A may connect oneamong the plurality of first column sub-pad terminals ROW_PAD_A and oneamong the plurality of second column sub-pad terminals ROW_PAD_B.

For example, the first column sub-pad terminal ROW_PAD_A_1 and thesecond column sub-pad terminal ROW_PAD_B_1 may be connected to eachother by the first terminal connection line TL_CN_A_1, and the firstcolumn sub-pad terminal ROW_PAD_A_2 and the second column sub-padterminal ROW_PAD_B_2 may be connected to each other by the firstterminal connection line TL_CN_A_2. Also, the first column sub-padterminal ROW_PAD_A_3 and the second column sub-pad terminal ROW_PAD_B_3may be connected to each other by the first terminal connection lineTL_CN_A_3, and the first column sub-pad terminal ROW_PAD_A_4 and thesecond column sub-pad terminal ROW_PAD_B_4 may be connected to eachother by the first terminal connection line TL_CN_A_4.

According to the present exemplary embodiment, the plurality of firstterminal connection lines TL_CN_A may have a shape that is bent at leastone time. For example, as shown in FIG. 5, the first terminal connectionline TL_CN_A_1 extends from the second column sub-pad terminalROW_PAD_B_1 to the first column sub-pad terminal ROW_PAD_A_1 along thesecond direction. In this case, the first terminal connection lineTL_CN_A_1 may be disposed in a shape that is bent in the firstdirection, and then is again bent in the second direction. That is, thefirst terminal connection line TL_CN_A_1 may be disposed in a shape thatis bent two times.

Meanwhile, a plurality of first column sub-pad terminals ROW_PAD_A maybe connected to the first connection wiring CL_A. For example, the firstcolumn sub-pad terminal ROW_PAD_A_1 may be connected with the firstconnection wiring CL_A_1, and the first column sub-pad terminalROW_PAD_A_2 may be connected with first connection wiring CL_A_2. Thefirst column sub-pad terminal ROW_PAD_A_3 may be connected with thefirst connection wiring CL_A_3, and the first column sub-pad terminalROW_PAD_A_4 may be connected with the first connection wiring CL_A_4.

At least one first dummy pad terminal DM_TL_A may be disposed between apair of adjacent first column sub-pad terminals ROW_PAD_A. For example,one first dummy pad terminal DM_TL_A_1 may be disposed between the firstcolumn sub-pad terminal ROW_PAD_A_1 and the first column sub-padterminal ROW_PAD_A_2, and one first dummy pad terminal DM_TL_A_2 may bedisposed between the first column sub-pad terminal ROW_PAD_A_2 and thefirst column sub-pad terminal ROW_PAD_A_3. One first dummy pad terminalDM_TL_A_3 may be disposed between the first column sub-pad terminalROW_PAD_A_3 and the first column sub-pad terminal ROW_PAD_A_4, and onefirst dummy pad terminal DM_TL_A_4 may be disposed close to the firstcolumn sub-pad terminal ROW_PAD_A_4.

FIG. 5 shows that one first dummy pad terminal DM_TL_A is disposedbetween a pair of adjacent first column sub-pad terminals ROW_PAD_A.However, the present invention is not limited thereto, and two or morefirst dummy pad terminals DM_TL_A may be disposed between adjacentcolumn sub-pad terminals.

In this case, the first column sub-pad terminals ROW_PAD_A and the firstdummy pad terminals DM_TL_A may be disposed to be parallel to eachother. That is, the first column sub-pad terminals ROW_PAD_A and thefirst dummy pad terminals DM_TL_A may all be arranged along the sameline, and may be disposed to be inclined at the first inclination angleθ1 with respect to the first direction.

As at least one first dummy pad terminal DM_TL_A may be disposed betweena pair of adjacent first column sub-pad terminals ROW_PAD_A, thedistance between the adjacent first column sub-pad terminals ROW_PAD_Ais increased such that capacitive bonding, that is, capacitive couplinggenerated between adjacent first column sub-pad terminals ROW_PAD_A, maybe prevented.

Also, at least one second dummy pad terminal DM_TL_B may be disposedbetween a pair of adjacent second column sub-pad terminals ROW_PAD_B.For example, one second dummy pad terminal DM_TL_B_1 may be disposedbetween the second column sub-pad terminal ROW_PAD_B_1 and the secondcolumn sub-pad terminal ROW_PAD_B_2, and one second dummy pad terminalDM_TL_B_2 may be disposed between the second column sub-pad terminalROW_PAD_B_2 and the second column sub-pad terminal ROW_PAD_B_3. Onesecond dummy pad terminal DM_TL_B_3 may be disposed between the secondcolumn sub-pad terminal ROW_PAD_B_3 and the second column sub-padterminal ROW_PAD_B_4, and one second dummy pad terminal DM_TL_B_4 may bedisposed adjacent to the second column sub-pad terminal ROW_PAD_B_4.

FIG. 5 shows that one second dummy pad terminal DM_TL_B is disposedbetween a pair of adjacent second column sub-pad terminals ROW_PAD_B.However, the present invention is not limited thereto, and two or moresecond dummy pad terminals DM_TL_B may be disposed between adjacentsecond column sub-pad terminals ROW_PAD_B.

The second column sub-pad terminals ROW_PAD_B and the second dummy padterminals DM_TL_B may be disposed to be parallel to each other. That is,the second column sub-pad terminals ROW_PAD_B and the second dummy padterminals DM_TL_B may all be arranged along one line, which is inclinedat the second inclination angle θ2 with respect to the first direction.

In the present exemplary embodiment, as the first column sub-padterminals ROW_PAD_A and the second column sub-pad terminals ROW_PAD_Bare disposed to be inclined at the predetermined angle with respect tothe first direction, many pad terminals may be disposed in apredetermined area.

Next, a structure of the second pad terminals PAD_TL_B disposed in thesecond terminal region TL_2 will be described with reference to FIG. 6.

FIG. 6 is an enlarged view of a second terminal region of FIG. 1.

Referring to FIG. 6, a plurality of second pad terminals PAD_TL_B may bedisposed in the second terminal region TL_2. In this case, the secondterminal region TL_2 may be connected to power lines, for example, thedriving power line ELVDDL, the common power line, the initializationpower line, the scan line, and the like disposed in the display regionDA through the second connection wiring CL_B. The plurality of secondpad terminals PAD_TL_B may be disposed to be separated from each otherat a predetermined interval in the first direction within the secondterminal region TL_2.

The plurality of second pad terminals PAD_TL_B may each include a pairof second sub-pad terminals SUB_PAD_B and a second terminal connectionline TL_CN_B.

A pair of second sub-pad terminals SUB_PAD_B may be disposed to beseparated from each other in one direction. In the present exemplaryembodiment, a pair of second sub-pad terminals SUB_PAD_B_1 andSUB_PAD_B_2 may be disposed to be separated from each other in thesecond direction. In this case, a pair of second sub-pad terminalsSUB_PAD_B_1 and SUB_PAD_B_2 may be arranged in one line along the seconddirection.

The second sub-pad terminal SUB_PAD_B may be formed to have anapproximate quadrangular shape. In the present exemplary embodiment, thesecond sub-pad terminal SUB_PAD_B may have a rectangular shape that iselongated in the second direction. In this case, the second sub-padterminals SUB_PAD_B_1 and SUB_PAD_B_2 are each formed with a rectangularshape having long sides and short sides that are adjacent to each other,and the length of the long sides is larger than the length of the shortsides by two times or more.

A pair of second sub-pad terminals SUB_PAD_B may be connected by asecond terminal connection line TL_CN_B. That is, the second terminalconnection lines TL_CN_B may be positioned between the second sub-padterminals SUB_PAD_B_1 and the second sub-pad terminals SUB_PAD_B_2, sothat the second sub-pad terminals SUB_PAD_B_1 and respective secondsub-pad terminals SUB_PAD_B_2 may be electrically connected.

According to the present exemplary embodiment, the second terminalconnection line TL_CN_B may be disposed in a straight line. Differentfrom the above-described first terminal connection lines TL_CN_A, thesecond terminal connection line TL_CN_B does not have a bent shape, butmay instead simply be disposed in a straight line. Accordingly, a pairof second sub-pad terminals SUB_PAD_B and the corresponding secondterminal connection line TL_CN_B may be arranged in one line.

The second sub-pad terminals SUB_PAD_B_1 may be connected to the secondconnection wiring CL_B. Accordingly, the second sub-pad terminalsSUB_PAD_B_1 may be connected to the power lines disposed in the displayregion DA through the second connection wiring CL_B. For example, thesecond sub-pad terminals SUB_PAD_B_1 may be electrically connected tothe driving power line or the common power line, and the like, throughthe second connection wiring CL_B.

In the present exemplary embodiment, a plurality of second pad terminalsPAD_TL_B is connected to the driving power line or the common powerline, thereby preventing a luminance reduction of the image displayed inthe display device. As described above, the second pad terminal PAD_TL_Bmay include a straight-shaped second terminal connection line TL_CN_B.That is, the second terminal connection line TL_CN_B is disposed as astraight line that is not bent, such that the increase in resistance ofthe wiring due to having a bent shape does not appear. Accordingly, asthe increase in resistance of the wiring is prevented, the reduction ofthe luminance generated in the display device may be prevented.

Next, an exemplary variation of the second terminal region TL_2 shown inFIG. 6 will be described with reference to FIG. 7.

Referring to FIG. 7, a plurality of second pad terminals PAD_TL_B′ maybe disposed in the second terminal region TL_2. The plurality of secondpad terminals PAD_TL_B′ may respectively include a pair of secondsub-pad terminals SUB_PAD_B′ and a second terminal connection lineTL_CN_B′.

Each pair of second sub-pad terminals SUB_PAD_B′ may be disposed in onedirection to be separated from each other. However, different from FIG.6, a pair of second sub-pad terminals SUB_PAD_B_1′ and SUB_PAD_B_2′ maybe arranged to be inclined at a third inclination angle θ3 with respectto the first direction. The third inclination angle θ3 may be in therange of 0 degrees-90 degrees (excluding 0 degrees and 90 degrees).

Meanwhile, a pair of second sub-pad terminals SUB_PAD_B′ may beconnected by a second terminal connection line TL_CN_B′. That is, thesecond terminal connection lines TL_CN_B′ may be positioned between thesecond sub-pad terminals SUB_PAD_B_1′ and the second sub-pad terminalsSUB_PAD_B_2′. And the second terminal connection lines TL_CN_B′ mayelectrically connect the second sub-pad terminals SUB_PAD_B_1′ and thesecond sub-pad terminals SUB_PAD_B_2′.

In the present exemplary variation, the second terminal connection lineTL_CN_B′ may be disposed with a straight shape. Accordingly, a pair ofsecond sub-pad terminals SUB_PAD_B′ and a second terminal connectionline TL_CN_B′ may be arranged along one line. In this case, a pair ofsecond sub-pad terminals SUB_PAD_B′ and the second terminal connectionline TL_CN_B′ may be arranged along a line that is inclined at the thirdinclination angle θ3 with respect to the first direction.

Next, the printed circuit board (PCB) 300 bonded to the display deviceaccording to an exemplary embodiment will be described with reference toFIG. 9 to FIG. 14.

FIG. 9 is a schematic top plan view of a printed circuit board (PCB)bonded to a display device of FIG. 1, FIG. 10 is an enlarged view of athird terminal region of FIG. 9, and FIG. 11 is a cross-sectional viewtaken along a line XI-XI′ of FIG. 10. FIG. 12 is an enlarged view of afourth terminal region of FIG. 9, FIG. 13 is a cross-sectional viewtaken along a line XIII-XIII′ of FIG. 12, and FIG. 14 is a view of anexemplary variation of a fourth terminal region of FIG. 12.

Referring to FIG. 9, the printed circuit board (PCB) 300 may include aflexible base film 310, a second pad unit PAD_2, and a driving chip 350.

The second pad unit PAD_2 may be disposed at one end of the base film310. According to the present exemplary embodiment, the second pad unitPAD_2 may be made with a shape corresponding to the shape of theabove-described first pad unit PAD_1 of the substrate SUB. As the secondpad unit PAD_2 of the printed circuit board (PCB) 300 and the first padunit PAD_1 of the substrate SUB may be formed with shapes correspondingto each other, the first pad unit PAD_1 and the second pad unit PAD_2may be more easily bonded.

The second pad unit PAD_2 may include a third terminal region TL_3 and afourth terminal region TL_4. The third terminal region TL_3 and thefourth terminal region TL_4 represent regions positioned on the basefilm 310. The third terminal region TL_3 and the fourth terminal regionTL_4 may be arranged in parallel along the first direction on the basefilm 310.

According to the present exemplary embodiment, the fourth terminalregion TL_4 may be disposed at both sides of the third terminal regionTL_3. However, the present invention is not limited thereto, and thefourth terminal region TL_4 may instead be disposed between a pair ofthird terminal regions TL_3.

The arrangement of the third terminal region TL_3 and the fourthterminal region TL_4 is determined depending on the arrangement of thefirst terminal region TL_1 and the second terminal region TL_2 disposedon the substrate SUB. For example, if the second terminal region TL_2 isdisposed at both sides of the first terminal region TL_1, the fourthterminal region TL_4 may be disposed at both sides of the third terminalregion TL_3. Further, if the second terminal region TL_2 is disposedbetween a pair of first terminal regions TL_1, the fourth terminalregion TL_4 may be disposed between a pair of third terminal regionsTL_3.

Referring to FIG. 10 and FIG. 11, the third terminal region TL_3 is aregion corresponding to the first terminal region TL_1 of the substrateSUB, and a plurality of third pad terminals PAD_TL_C may be disposed inthe third terminal region TL_3.

The plurality of third pad terminals PAD_TL_C may be disposed in thesame pattern as the first pad terminals PAD_TL_A disposed in theabove-described first terminal region TL_1. That is, the plurality ofthird pad terminals PAD_TL_C of the third terminal region TL_3 may beformed with a third pattern corresponding to the above-described firstpattern.

The plurality of third pad terminals PAD_TL_C may include third columnsub-pad terminals ROW_PAD_C and fourth column sub-pad terminalsROW_PAD_D.

In the present exemplary embodiment, the third column sub-pad terminalsROW_PAD_C may be disposed along one direction to be separated from eachother. In this case, the third column sub-pad terminals ROW_PAD_C mayform the first inclination angle θ1 with respect to the first direction.The third column sub-pad terminals ROW_PAD_C may be arranged to beinclined at the first inclination angle θ1 with respect to the firstdirection. That is, the third column sub-pad terminals ROW_PAD_C may bearranged to be inclined at the same angle as the first column sub-padterminals ROW_PAD_A of the substrate SUB. In this case, the firstinclination angle θ1 may be in the range of 0 degrees-90 degrees(excluding 0 degrees and 90 degrees).

Further, the interval between adjacent third column sub-pad terminalsROW_PAD_C may be constant. For example, the interval between the thirdcolumn sub-pad terminal ROW_PAD_C_1 and the third column sub-padterminal ROW_PAD_C_2, the interval between the third column sub-padterminal ROW_PAD_C_2 and the third column sub-pad terminal ROW_PAD_C_3,and the interval between the third column sub-pad terminal ROW_PAD_C_3and the third column sub-pad terminal ROW_PAD_C_4 may be equal. In thiscase, adjacent third column sub-pad terminals ROW_PAD_C may be arrangedat an interval that is equal to the interval between the above-describedfirst column sub-pad terminals ROW_PAD_A.

The third column sub-pad terminals ROW_PAD_C may be formed with anapproximate quadrangular shape.

The fourth column sub-pad terminals ROW_PAD_D may be disposed to beseparated from the third column sub-pad terminals ROW_PAD_C in thesecond direction. Like the third column sub-pad terminals ROW_PAD_C, thefourth column sub-pad terminals ROW_PAD_D may be disposed to beseparated from each other in one direction.

In this case, the fourth column sub-pad terminals ROW_PAD_D may form thesecond inclination angle θ2 with respect to the first direction. Thatis, the fourth column sub-pad terminals ROW_PAD_D may be arranged alonga line that is inclined at the second inclination angle θ2 with respectto the first direction. That is, the fourth column sub-pad terminalsROW_PAD_D may be arranged to be inclined at the same angle as the secondcolumn sub-pad terminals ROW_PAD_B of the substrate SUB. In this case,the second inclination angle θ2 may be in the range of 0 degrees-90degrees (excluding 0 degrees and 90 degrees).

In the present exemplary embodiment, like the first column sub-padterminals ROW_PAD_A and the second column sub-pad terminals ROW_PAD_B ofthe substrate SUB, the first inclination angle θ1 and the secondinclination angle θ2 may be equal to each other. Accordingly, the thirdcolumn sub-pad terminals ROW_PAD_C and the fourth column sub-padterminals ROW_PAD_D may be arranged to be inclined at the same anglewith respect to the first direction.

However, the present invention is not limited thereto, and the firstinclination angle θ1 and the second inclination angle θ2 may bedifferent from each other. Accordingly, the third column sub-padterminals ROW_PAD_C and the fourth column sub-pad terminals ROW_PAD_Dmay be arranged to be inclined at different angles with the firstdirection.

Meanwhile, the intervals between the adjacent fourth column sub-padterminals ROW_PAD_D may be equal to each other. For example, theinterval between the fourth column sub-pad terminal ROW_PAD_D_1 and thefourth column sub-pad terminal ROW_PAD_D_2, the interval between thefourth column sub-pad terminal ROW_PAD_D_2 and the fourth column sub-padterminal ROW_PAD_D_3, and the interval between the fourth column sub-padterminal ROW_PAD_D_3 and the fourth column sub-pad terminal ROW_PAD_D_4may be equal.

The fourth column sub-pad terminals ROW_PAD_D may be formed to have anapproximate quadrangular shape.

Meanwhile, the first terminal wiring P_L A_1 and the second terminalwiring P_L_B_1 may be positioned at opposing sides of the base film 310in the printed circuit board (PCB). The first terminal wiring P_L_A_1may be positioned on or over the base film 310, and the second terminalwiring P_L_B_1 may be positioned under the base film 310. In this case,the first terminal wiring P_L A_1 and the second terminal wiring P_L_B_1may be electrically connected to the driving chip 350, respectively.

A first protection layer SR1 may be disposed on the first terminalwiring P_L_A_1, and a second protection layer SR2 may be disposed on thesecond terminal wiring P_L_B_1. In this case, the first protection layerSR1 and the second protection layer SR2 may each be a solder resist.

The third column sub-pad terminal ROW_PAD_C_1 and the fourth columnsub-pad terminal ROW_PAD_D_1 may be formed of the same layer as thesecond terminal wiring P_L_B_1. For the third column sub-pad terminalROW_PAD_C_1 and the fourth column sub-pad terminal ROW_PAD_D_1, a partof the second protection layer SR2 is removed such that a part of thesecond terminal wiring P_L_B_1 may be exposed. In this case, the thirdcolumn sub-pad terminal ROW_PAD_C_1 and the fourth column sub-padterminal ROW_PAD_D_1 are separated from each other.

In this case, the third column sub-pad terminal ROW_PAD_C_1 may beelectrically connected to the first terminal wiring P_L_A_1 through afirst contact hole CT_1 formed in the base film 310. In a plan view, thefirst contact hole CT_1 may be disposed to overlap the third columnsub-pad terminal ROW_PAD C 1. In the present case, the first contacthole CT_1 is filled with the same metal as the first terminal wiringP_L_A_1, but may instead be filled with the metal of the third columnsub-pad terminal ROW_PAD_C_1.

Meanwhile, the fourth column sub-pad terminal ROW_PAD_D_1 may be formedof the same metal layer as the second terminal wiring P_L_B_1. In thepresent exemplary embodiment, the fourth column sub-pad terminalROW_PAD_D_1 may correspond to a region where a part of the secondterminal wiring P_L_B_1 is exposed.

Referring to FIG. 12 and FIG. 13, the fourth terminal region TL_4 is aregion corresponding to the second terminal region TL_2 of the substrateSUB, and a plurality of fourth pad terminals PAD_TL_D may be disposed inthe fourth terminal region TL_4.

The plurality of fourth pad terminals PAD_TL_D may be disposed in thesame pattern as the second pad terminals PAD_TL_B disposed in theabove-described second terminal region TL_2. That is, the plurality offourth pad terminals PAD_TL_D of the fourth terminal region TL_4 may beformed in the fourth pattern corresponding to the above-described secondpattern.

The plurality of fourth pad terminals PAD_TL_D may respectively includea pair of fourth sub-pad terminals SUB_PAD_D.

Each pair of fourth sub-pad terminals SUB_PAD_D may be disposed in onedirection to be separated from each other. In the present exemplaryembodiment, a pair of fourth sub-pad terminals SUB_PAD_D_1 andSUB_PAD_D_2 may be disposed along the second direction to be separatedfrom each other. In this case, a pair of fourth sub-pad terminalsSUB_PAD_D_1 and SUB_PAD_D_2 may be disposed in one line along the seconddirection.

The fourth sub-pad terminal SUB_PAD_D may be made to have an approximatequadrangular shape. In the present exemplary embodiment, the fourthsub-pad terminal SUB_PAD_D may have a rectangular shape that iselongated in the second direction. In this case, the fourth sub-padterminals SUB_PAD_D_1 and SUB_PAD_D_2 have a rectangular shape havingadjacent long sides and short sides, and the length of the long sides islarger than the length of the short sides by two times or more.

The fourth sub-pad terminals SUB_PAD_D_1 and SUB_PAD_D_2 may be formedof the same layer as the second terminal wiring P_L B_2. For the fourthsub-pad terminals SUB_PAD_D_1 and SUB_PAD_D_2, part of the secondprotection layer SR2 is removed such that parts of the second terminalwiring P_L_B_1 are exposed. In this case, the fourth sub-pad terminalsSUB_PAD_D_1 and SUB_PAD_D_2 are separated from each other.

Meanwhile, like the third terminal region TL_3, the first terminalwiring P_L_A_2 and the second terminal wiring P_L_B_2 may be positionedat opposing sides of the base film 310 in the printed circuit board(PCB). The first terminal wiring P_L A_2 may be positioned on the basefilm 310, and the second terminal wiring P_L_B_2 may be positioned underthe base film 310. In this case, the first terminal wiring P_L A_2 andthe second terminal wiring P_L_B_2 may be respectively and electricallyconnected to the driving chip 350.

In this case, the fourth sub-pad terminal SUB_PAD_D_1 may beelectrically connected to the first terminal wiring P_L_A_2 through thesecond contact hole CT_2 formed in the base film 310. In a plan view,the fourth sub-pad terminal SUB_PAD_D_1 and the second contact hole CT_2are arranged to not overlap each other. The second terminal wiringP_L_B_2 may be formed extend in the second direction from the fourthsub-pad terminal SUB_PAD_D_1. Also, the second contact hole CT_2 mayoverlap the second terminal wiring P_L_B_2. In this case, the same metalas that of the first terminal wiring P_L_A_2 may be filled in the secondcontact hole CT_2, or the metal configuring the fourth sub-pad terminalSUB_PAD_D_1 may be filled therein.

Meanwhile, the fourth sub-pad terminal SUB_PAD_D_2 may be formed of thesame metal layer as the second terminal wiring P_L_B_2. In the presentexemplary embodiment, the fourth sub-pad terminal SUB_PAD_D_2 maycorrespond to a region where part of the second terminal wiring P_L_B_2is exposed.

Next, an exemplary variation of the fourth terminal region TL_4 shown inFIG. 12 will be described with reference to FIG. 14.

Referring to FIG. 14, a plurality of fourth pad terminals PAD_TL_D′ maybe disposed in the fourth terminal region TL_4. Each of a plurality offourth pad terminals PAD_TL_D′ may include a pair of fourth sub-padterminals SUB_PAD_D′.

A pair of fourth sub-pad terminals SUB_PAD_D′ may be disposed in onedirection to be separated from each other. However, differently fromFIG. 12, a pair of fourth sub-pad terminals SUB_PAD_D_1′ andSUB_PAD_D_2′ may be arranged at the third inclination angle θ3 with thefirst direction. The third inclination angle θ3 formed by the fourthsub-pad terminals SUB_PAD_D_1′ and SUB_PAD_D_2′ of FIG. 14 may be thesame as the angle formed by the second sub-pad terminal SUB_PAD_D′formed on the substrate SUB of FIG. 7.

Next, an exemplary variation of the printed circuit board (PCB) will bedescribed with reference to FIG. 15 and FIG. 16.

FIG. 15 is a view of a first exemplary variation of the printed circuitboard (PCB) of FIG. 9, and FIG. 16 is a view of a second exemplaryvariation of the printed circuit board (PCB) of FIG. 9.

In FIG. 9, the plurality of third pad terminals PAD_TL_C of the thirdterminal region TL_3 may be disposed with the same pattern as the firstpad terminals PAD_TL_A disposed in the first terminal region TL_1 ofFIG. 1. The plurality of third pad terminals PAD_TL_C may be disposed tobe inclined at the same angle within the third terminal region TL_3.That is, the plurality of third pad terminals PAD_TL_C may be inclinedin the approximate 1 o'clock direction.

However, in the first exemplary variation of the printed circuit board(PCB) of FIG. 15, the plurality of third pad terminals PAD_TL_C of thethird terminal region TL_3 may be disposed with the same pattern as thefirst pad terminals PAD_TL_A disposed in the first terminal region TL_1of FIG. 8.

The plurality of third pad terminals PAD_TL_C of the third terminalregion TL_3 may be disposed to be symmetric to each other with respectto the center region of the third terminal region TL_3. For example, theplurality of third pad terminals PAD_TL_C to the left of the centerregion of the third terminal region TL_3 may be inclined in theapproximate 1 o'clock direction, and the plurality of third padterminals PAD_TL_C to the right of the center region of the thirdterminal region TL_3 may be inclined in the approximate 11 o'clockdirection.

Referring to FIG. 16, the plurality of fourth pad terminals PAD_TL_Ddisposed in the fourth terminal region TL_4 may be disposed at differentangles with respect to the first direction (the X-axis). For example, inthe fourth terminal region TL_4 positioned at the right side of thethird terminal region TL_3, the angle of the fourth pad terminalsPAD_TL_D with respect to the X-axis may gradually decrease from the leftside to the right side. In contrast, in the fourth terminal region TL_4positioned at the right side of the third terminal region TL_3, theangle of the fourth pad terminals PAD_TL_D with respect to the X-axismay gradually increase from the left side to the right side.

Alternatively, in the fourth terminal region TL_4 positioned at the leftside of the third terminal region TL_3, the angle of the fourth padterminals PAD_TL_D with respect to the X-axis may gradually decreasefrom the right side to the left side. Likewise, in the fourth terminalregion TL_4 positioned at the left side of the third terminal regionTL_3, the angle of the fourth pad terminals PAD_TL_D with respect to theX-axis may gradually increase from the right side to the left side.

Next, a state in which the second terminal region TL_2 and the fourthterminal region TL_4 are bonded to each other will be described withreference to FIG. 17 and FIG. 18.

FIG. 17 is a view schematically showing a state in which a secondterminal region formed in a substrate and a fourth terminal regionformed in a printed circuit board (PCB) are bonded, and FIG. 18 is across-sectional view taken along a line XVIII-XVIII′ of FIG. 17.

When the printed circuit board (PCB) 300 is bonded to the pad regionPNL_PAD of the substrate SUB, the second sub-pad terminals SUB_PAD_B_1and SUB_PAD_B_2 of the second terminal region TL_2, and the fourthsub-pad terminals SUB_PAD_D_1 and SUB_PAD_D_2 of the fourth terminalregion TL_4, may be disposed to overlap each other.

In detail, the fourth sub-pad terminal SUB_PAD_D_1 is disposed tooverlap the second sub-pad terminal SUB_PAD_B_1, and the fourth sub-padterminal SUB_PAD_D_2 is disposed to overlap the second sub-pad terminalSUB_PAD_B_2.

Next, a conductive adhesive film 500 may be disposed between the secondterminal region TL_2 and the fourth terminal region TL_4. The conductiveadhesive film 500 electrically connects the second sub-pad terminalsSUB_PAD_B_1 and SUB_PAD_B_2 to the fourth sub-pad terminals SUB_PAD_D_1and SUB_PAD_D_2. The second sub-pad terminals SUB_PAD_B_1 andSUB_PAD_B_2 and the fourth sub-pad terminals SUB_PAD_D_1 and SUB_PAD_D 2may be electrically connected through a plurality of conductive ballsCNB included in the conductive adhesive film 500.

Next, a state in which the first terminal region TL_1 and the thirdterminal region TL_3 are bonded to each other will be described withreference to FIG. 19 and FIG. 20.

FIG. 19 is a view schematically showing a state in which a secondterminal region formed in a substrate and a third terminal region formedin a printed circuit board (PCB) are bonded, and FIG. 20 is across-sectional view taken along a line XX-XX′ of FIG. 19.

The third pad terminals PAD_TL_C (referring to FIG. 10) may be disposedto overlap the first pad terminals PAD_TL_A (referring to FIG. 5). Indetail, the third column sub-pad terminals ROW_PAD_C may overlap and bedisposed on the first column sub-pad terminals ROW_PAD_A, and the fourthcolumn sub-pad terminals ROW_PAD_D may overlap and be disposed on thesecond column sub-pad terminals ROW_PAD_B.

Also, the conductive adhesive film 500 may be disposed between the firstterminal region TL_1 and the third terminal region TL_3. The conductiveadhesive film 500 may electrically connect the first column sub-padterminals ROW_PAD_A and the third column sub-pad terminals ROW_PAD_C.The first column sub-pad terminals ROW_PAD_A and the third columnsub-pad terminals ROW_PAD_C may be electrically connected to each otherthrough the plurality of conductive balls CNB included in the conductiveadhesive film 500.

In the display device according to an exemplary embodiment, the firstterminal region TL_1 and the second terminal region TL_2 are formed inthe first pad unit PAD_1, and in this case, the plurality of first padterminals PAD_TL_A disposed in the first terminal region TL_1 and theplurality of second pad terminals PAD_TL_B disposed in the secondterminal region TL_2 may have different patterns from each other.

While this invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims. Various features of the above describedand other embodiments can thus be mixed and matched in any manner, toproduce further embodiments consistent with the invention.

DESCRIPTION OF SYMBOLS

-   -   SUB substrate    -   DA display region    -   PNL_PAD pad region    -   PAD_1 first pad unit    -   PAD_2 second pad unit    -   TL_1 first terminal region    -   TL_2 second terminal region    -   TL_3 third terminal region    -   TL_4 fourth terminal region    -   PAD_TL_A first pad terminal    -   PAD_TL_B second pad terminal    -   PAD_TL_C third pad terminal    -   PAD_TL_D fourth pad terminal    -   TL_CN_A first terminal connection lines    -   ROW_PAD_A first column sub-pad terminals    -   ROW_PAD_B second column sub-pad terminals    -   DM_TL_A first dummy pad terminal    -   DM_TL_B second dummy pad terminal    -   SUB_PAD_B second sub-pad terminal    -   TL_CN_B second terminal connection line    -   300 printed circuit board (PCB)    -   310 base film    -   350 driving chip    -   SR1 first protection layer    -   SR2 second protection layer    -   CT_1 first contact hole    -   CT_2 second contact hole    -   500 conductive adhesive film    -   CNB conductive ball

What is claimed is:
 1. A display device comprising: a substrateincluding a plurality of first pad terminals and a plurality of secondpad terminals; and a printed circuit board including a base film, aplurality of third pad terminals and a plurality of fourth padterminals, wherein the substrate further comprises: each of theplurality of first pad terminals includes a first column sub-padterminal, and a second column sub-pad terminal; and each of theplurality of second pad terminals includes a pair of second sub-padterminals, wherein the printed circuit board further comprises: each ofthe plurality of third pad terminals includes a third column sub-padterminal, and a fourth column sub-pad terminal; each of the plurality offourth pad terminals includes a pair of fourth sub-pad terminals; afirst terminal wiring connected to the third column sub-pad terminalthrough a first contact hole formed in the base film; and a secondterminal wiring connected to one of the pair of fourth sub-pad terminalsthrough a second contact hole formed in the based film, wherein: thefirst column sub-pad terminal is electrically connected to the thirdcolumn sub-pad terminal, the second column sub-pad terminal iselectrically connected to the fourth column sub-pad terminal, one padterminal of the pair of second sub-pad terminals is electricallyconnected to one pad terminal of the pair of fourth sub-pad terminals,and another pad terminal of the pair of second sub-pad terminals iselectrically connected to another pad terminal of the pair of fourthsub-pad terminals, and wherein: the first contact hole overlaps thethird column sub-pad terminal in a plan view, and the second contacthole is disposed to be separated in the plan view.
 2. The display deviceof claim 1, wherein the substrate is divided into a display region and aperipheral area, the display region is configured to display an image,and the peripheral area includes a pad region where the plurality offirst pad terminals and the plurality of second pad terminals aredisposed.
 3. The display device of claim 2, wherein the substratefurther comprises: a plurality of data lines disposed in the displayregion, and a plurality of power lines configured to supply a voltage tothe display region.
 4. The display device of claim 3, wherein theplurality of first pad terminals are connected to respective ones of theplurality of data lines.
 5. The display device of claim 4, wherein theplurality of second pad terminals are respectively connected to theplurality of power lines.
 6. The display device of claim 5, wherein theplurality of power lines include at least one among a driving voltageline, a common power line, an initialization power line, and a gateline.
 7. The display device of claim 5, wherein the plurality of secondpad terminals are divided and disposed at both sides of a first regionwhere the plurality of first pad terminals are disposed.
 8. The displaydevice of claim 7, wherein the plurality of second pad terminals of theboth sides are disposed to be symmetric with respect to the firstregion.
 9. The display device of claim 2, wherein the plurality of firstpad terminals are divided and disposed at both sides of a second regionwhere the plurality of second pad terminals are disposed.
 10. Thedisplay device of claim 9, wherein the plurality of first pad terminalsof the both sides are disposed to be symmetric with respect to thesecond region.
 11. The display device of claim 1, wherein the printedcircuit board further comprises a driving chip positioned at a firstsurface of the base film different from a second surface where theplurality of third pad terminals and the plurality of fourth padterminals are disposed.
 12. The display device of claim 1, wherein thebase film is flexible.
 13. The display device of claim 1, wherein theplurality of first pad terminals and the plurality of second padterminals are arranged in different shapes.
 14. The display device ofclaim 13, wherein a plurality of first column sub-pad terminals arearranged substantially along a first line forming a first inclinationangle with a first direction.
 15. The display device of claim 14,wherein a plurality of second column sub-pad terminals are arrangedsubstantially along a second line forming a second inclination anglewith the first line.
 16. The display device of claim 13, wherein theplurality of third pad terminals are arranged in a first correspondingshape to the plurality of first pad terminals, and the plurality offourth pad terminals are arranged in a second corresponding shape to theplurality of second pad terminals.
 17. The display device of claim 16,wherein a plurality of first column sub-pad terminals and a plurality ofthird column sub-pad terminals are arranged substantially along a firstline forming a first inclination angle with a first direction.
 18. Thedisplay device of claim 17, wherein a plurality of second column sub-padterminals and a plurality of fourth column sub-pad terminals arearranged substantially along a second line forming a second inclinationangle with the first line.
 19. The display device of claim 18, whereinthe pair of second sub-pad terminals and the pair of fourth sub-padterminals are respectively arranged along a second directionperpendicular to the first direction.
 20. The display device of claim 1,wherein the substrate further comprises at least one first dummy padterminal disposed between a pair of adjacent first column sub-padterminals, and wherein the printed circuit board further comprises atleast one second dummy pad terminal disposed between a pair of adjacentsecond column sub-pad terminals.
 21. The display device of claim 20,wherein the pair of adjacent first column sub-pad terminals and the atleast one first dummy pad terminal are arranged along a same line, andthe pair of adjacent second column sub-pad terminals and the at leastone second dummy pad terminal are arranged along a same line.